Model - Metrology Verification/Overlay/Single Machine Overlay/TTL/TT
Operator:ASM    Machine:	 Release:8.9.0    Date:05/06/2026  Time:10:17


   Single Machine Overlay                            

Exposure Layer        : --- First ---               : --- Second ---
Date/Time             : Wed May  6 09:41:07 2026    : Wed May  6 09:55:22 2026
Machine ID            :  4752                       :  4752
Reticle ID            : 45443171A094                : 45443171A094            
Reference Grid        :                             :       
Matching set ID       : ORIGINAL                    : ORIGINAL       
Reticle Alignment     : TTL Align                   : TTL Align 
Wafer Alignment       : TTL Align                   : TTL Align 
Lens Type             : 70                          : 70      
Lens ID               : 0113954a                    : 0113954a
Energy    [mJ/cm2]    :   18.0                      :   18.0 
Focus Offset  [um]    :   0.00                      :   0.00  
Illumination Mode     : Conventional                : Conventional   
Blade ID              :                             :                
Numerical Aperture    : 0.66                        : 0.66    
Sigma Inner           :                             :         
Sigma Outer           : 0.65                        : 0.65    
Temperature [degC]    : 22.0                        : 22.0  
Pressure    [mbar]    : 986.4                       : 986.5   
Wavelength    [nm]    : 248.314                     : 248.314   

Comments from:
  'Exposure First Layer'   :                                                   
  'Exposure Second Layer'  :                                                   
  'Measure Mark Positions' :                                                   
  'XY-Imaging Modelling'   :                                                   

Test Log Name              : XYN_4752_4752.tlg                                 
Optimization Method        : Least-Squares  
Number of Wafers           :       1
Number of Rejected Wafers  :       0
Number of Fields per Wafer :      20
Number of Marks per Field  :      25
Alignment Errors in Data   :       0
Max Field Size X      [mm] :      26.0
               Y      [mm] :      33.0

Wafer/Field/Mark Selection : *:*:*                                             
Align. Errors in Selection :       0
Overlay Mode               : Second to First     
Set Threshold              : OFF 

Reticle data used   : Reticle data from testlog                         
Reticle layout used : 4X_SU_DYNA_25                                     
                      

   

==============================================================================



 Overlay Error for this Batch:                                                  



+------------------+-----------------------------+
|                  |   Filtered Overlay Error    |
|                  +---------+---------+---------+
|                  |    X    |    Y    | Vector  |
|                  |  [nm]   |  [nm]   |  [nm]   |
+==================+=========+=========+=========+
| Mean             |    -2.2 |    -1.0 |         |
| St. Dev.         |    24.4 |     2.9 |         |
| |Mean| + 3 Sigma |    75.5 |     9.7 |         |
| Maximum 99.7%    |   118.9 |    12.1 |   118.9 |
+------------------+---------+---------+---------+


 Intrafield Overlay Error Classification:                                       



+------------------------------+---------------------+---------------------+
|                              |  Model Parameters   |Max. Resulting Errors|
|                              +----------+----------+----------+----------+
|                              |   Mean   |Std. Dev. |   Mean   |Std. Dev. |
|                              |          |          |   [nm]   |   [nm]   |
+==============================+==========+==========+==========+==========+
| Translation in X       [um]  |   -0.002 |    0.011 |     -2.2 |     11.2 |
| Translation in Y       [um]  |   -0.001 |    0.001 |     -1.0 |      1.2 |
| Rotation             [urad]  |   -0.110 |    0.323 |     -2.3 |      6.8 |
| Magnification         [ppm]  |    0.799 |    2.394 |     16.8 |     50.3 |
| 3rd Order Dist.    [nm/cm3]  |   -7.086 |   23.824 |    -15.6 |     52.3 |
| Asymm. Rotation      [urad]  |    0.017 |    0.330 |      0.4 |      6.9 |
| Asymm. Magnification  [ppm]  |    0.889 |    2.401 |     18.7 |     50.4 |
+------------------------------+----------+----------+----------+----------+


 Interfield Overlay Error Classification:                                       



+------------------------------+---------------------+---------------------+
|                              |  Model Parameters   |Max. Resulting Errors|
|                              +----------+----------+----------+----------+
|                              |   Mean   |Std. Dev. |   Mean   |Std. Dev. |
|                              |          |          |   [nm]   |   [nm]   |
+==============================+==========+==========+==========+==========+
| Translation in X       [um]  |   -0.002 |    0.000 |    -2.2  |     0.0  |
| Translation in Y       [um]  |   -0.001 |    0.000 |    -1.0  |     0.0  |
| Wafer Rotation       [urad]  |   -0.005 |    0.000 |    -0.5  |     0.0  |
| Nonorthogonality     [urad]  |    0.009 |    0.000 |     0.9  |     0.0  |
| Scaling in X          [ppm]  |   -0.024 |    0.000 |    -2.5  |     0.0  |
| Scaling in Y          [ppm]  |    0.016 |    0.000 |     1.6  |     0.0  |
| Rotation Scaling  [urad/cm]  |          |          |          |          |
+------------------------------+----------+----------+----------+----------+


 Residuals for this batch:                                                      



+--------------------+---------+
|                    |  Value  |
+====================+=========+
| Residual X [nm]    |     6.1 |
| Residual Y [nm]    |     1.1 |
+--------------------+---------+